Core Advantages (vs. Traditional Wave Soldering)

1.Precision Selectivity

Targets only designated solder joints, protects heat-sensitive and sealed components, and reduces the risks of thermal shock and deformation.

2.Enhanced Soldering Quality

Minimizes bridging, solder spikes and cold joints for high solder joint consistency. Nitrogen protection effectively reduces oxidation.

3.Cost Optimization

Significantly cuts down solder and flux consumption, generates less dross, and lowers maintenance and cleaning costs.

4.Flexible Design Compatibility

Offers greater freedom in PCB layout, and is suitable for high-density and hybrid processes (SMD+THT).

5.High-Efficiency Line Changeover

Features fast program switching, reduces line changeover time by 80%, and is ideal for high-mix low-volume production.

Ideal Applications:

High-mix low-volume production, high-reliability requirements, assemblies with heat-sensitive components, high-density hybrid processes, long-term cost-sensitive projects.